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Read NXP Locked Microprocessor SPC5602DF1MLL4 Flash Program
The internal voltage regulator requires external capacitance (CREGn) to be connected to the device in order to provide a stable low voltage digital supply to the device. Capacitances should be placed on the board as near as possible to the associated pins when crack microprocessor spc5601 flash memory.
Care should also be taken to limit the serial inductance of the board to less than 5 nH. Each decoupling capacitor must be placed between each of the three VDD_LV/VSS_LV supply pairs to ensure stable voltage.
VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = -40 to 125 °C, unless otherwise specified.
This capacitance value is driven by the constraints of the external voltage regulator supplying the VDD_BV voltage. A typical value is in the range of 470 nF.
This value is acceptable to guarantee operation from 4.5 V to 5.5 V.
External regulator and capacitance circuitry must be capable of providing IDD_BV while maintaining supply VDD_BV in operating range.
In-rush average current is seen only for short time during power-up and on standby exit (maximum 20 µs, depending on external capacitances to be loaded) in the process of unlocking spc5601pef microcomputer flash memory.
The duration of the in-rush current depends on the capacitance placed on LV pins. BV decoupling capacitors must be sized accordingly. Refer to IMREG value for minimum amount of current to be provided in cc.